Chair: Shuo Wang – University of Florida

Chair: Yuichi Hayashi – Nara Institute of Science and Technology

Co-Chair: William Radasky – Metatech Corporation

Chair: Daniel Hoolihan – Hoolihan EMC Consulting

Organizer: Bob DeLisi – UL LLC

Organizer: Janet O'Neil – ETS-Lindgren

Co-Chair: Craig Fanning – Elite Electronic Engineering, Inc.

Co-Chair: Garth D'Abreu – ETS-Lindgren

Chair: Henry Benitez – Electrical Engineering, ElectroMagnetic Investigations

Presenting Author: Henry Benitez – Electrical Engineering, ElectroMagnetic Investigations

Presenting Author: Lynn J. Petersen – Office of Naval Research

Presenting Author: William Hurst – ANAB Technical Assessor

Presenting Author: Shuo Wang – University of Florida

Presenting Author: William H. Graff – TCB Council

Presenting Author: Nathalie Rioux – National Institute of Standards and Technology

Presenting Author: Yasaman Ardeshirpour – US Food and Drug Administration

Presenting Author: Megan McConnell – American Association for Laboratory Accreditation- Accreditation Services

Presenting Author: Andy Griffin – Cisco Systems, Inc.

Presenting Author: Ghery Pettit – Pettit EMC Consulting LLC

Presenting Author: Craig Fanning – Elite Electronic Engineering, Inc.

Presenting Author: Yuichi Hayashi – Nara Institute of Science and Technology

Presenting Author: Chulsoon Hwang – Missouri University of Science & Technology

Presenting Author: Kengo Iokibe – Okayama University

Presenting Author: Shahin Tajik – Worcester Polytechnic Institute

Presenting Author: Youngwoo Kim – Sejong University

Presenting Author: William Elliott – TUV SUD America

Presenting Author: Jeff Evans – Consultant

Presenting Author: Pelin Salem – Cisco Systems Inc.

Presenting Author: Andy Griffin – Cisco Systems, Inc.

Presenting Author: Nicholas Abbondante – Intertek

Presenting Author: Sergej Bub – Nexperia

Presenting Author: Ronald Missier – Ford Motor Company

Presenting Author: Patrick DeRoy – Analog Devices Inc.

Presenting Author: Daniel N. Aloi – Oakland University

Presenting Author: Garth D'Abreu – ETS-Lindgren

Presenting Author: Dushan Boroyevich – Virginia Polytechnic Institute

Presenting Author: Seungdeog Choi – Mississippi State University

Presenting Author: Dong Dong – Virginia Polytechnic Institute and State University

Presenting Author: Fang Luo – Stony Brook University

Presenting Author: Ashkan Barzkar – Virginia Polytechnic Institute and State University

Presenting Author: Shuo Wang – University of Florida

Co-Chair: Carl E. Hager, IV – University of Maryland

Co-Chair: Robert Davis – Lockheed Martin (Retired)

Presenting Author: Mark Waller – Auburn University

Presenting Author: Finbarr O'Connor – Huntington Ingalls Industries

Presenting Author: Mark Waller – Auburn University

Presenting Author: AJM van Bladel – Dutch Ministry of Defence; NATO E3 Action Team

Presenting Author: Tiffany Morisak – NAVAIR

Presenting Author: John Howson IV – NAVAIR Patuxent Naval Air Station

Presenting Author: Phillip Melton – University of North Carolina

Presenting Author: Frank Leferink – Thales and University of Twente

Presenting Author: Robert Tarrant – US Army Aberdeen Test Center

Presenting Author: Petter Gärdin – Swedish Armed Forces

Presenting Author: Sarah A. Seguin – Aerospace Corporation

Presenting Author: Randy Jost – Utah State University

Co-Chair: Jen Dimov – NASA/Goddard Space Flight Center

Co-Chair: John McCloskey – NASA/Goddard Space Flight Center

Presenting Author: John McCloskey – NASA/Goddard Space Flight Center

Presenting Author: Bruce Archambeault – Missouri University of Science and Technology

Presenting Author: Eric Bogatin – ECEE

Presenting Author: Xiaoning Ye – Intel Corporation

Presenting Author: Chulsoon Hwang – Missouri University of Science & Technology

Presenting Author: Todd Hubing – LearnEMC

Presenting Author: Frank Leferink – Thales and University of Twente

Presenting Author: Lee Hill – SILENT Solutions LLC

Presenting Author: Cheung-Wei Lam – Apple Inc.

Chair: Monrad Monsen – Oracle

Chair: Charles Jullien – Safran Electrical & Power

Co-Chair: Huadong Li – Molex,LLC

Chair: Keith Armstrong – Cherry Clough Consultants Ltd

Co-Chair: Davy Pissoort – Katholieke Universiteit Leuven

Chair: Michael McInerney – Consultant

Co-Chair: William Radasky – Metatech Corporation

Chair: Martin Wiles – MVG World

Co-Chair: Paul Duxbury – MVG - Microwave Vision Group

Presenting Author: Michael McInerney – Consultant

Presenting Author: Martin Wiles – MVG World

Presenting Author: William Radasky – Metatech Corporation

Presenting Author: Marco Klingler – EMC Consultant

Presenting Author: Robert Smolenski – Uniwersytet Zielonogórski

Presenting Author: Marco Klingler – EMC Consultant

Presenting Author: Jerry Ramie – ARC Technical Resources

Presenting Author: Tyler Dodge – Dassault Systѐmes

Presenting Author: Roman Jobava – EMCoS LLC

Presenting Author: C.J. Reddy – Altair

Presenting Author: Ghery Pettit – Pettit EMC Consulting LLC

Presenting Author: Ghery Pettit – Pettit EMC Consulting LLC

Presenting Author: Tom Braxton – Elite Electronic Engineering Inc- Global Compliance

Presenting Author: Ross Carlton – Gibbs & Cox

Presenting Author: William Radasky – Metatech Corporation

Presenting Author: Griffin Kowash – Electro Magnetic Applications, Inc.

Presenting Author: Charles Jullien – Safran Electrical & Power

Presenting Author: Huadong Li – Molex,LLC

Presenting Author: Paul Bremner – Robust Physics

Presenting Author: Gary Biddle – SAMTEC

Presenting Author: Eugene Mayevksiy – TE Connectivity Ltd Berwyn

Presenting Author: Furkan Şahin – Technische Universiteit Eindhoven

Presenting Author: Keith Armstrong – Cherry Clough Consultants Ltd

Presenting Author: Keith Armstrong – Cherry Clough Consultants Ltd

Presenting Author: D. Pissoort – Katholieke Universiteit Leuven

Chair: Giulio Antonini – University of L'Aquila

Co-Chair: Lijun Jiang – Missouri University of Science and Technology

Chair: Thanh Tran – Rice University

Chair: Kinger Cai – Intel Corporation

Organizer: Baolong Li – Cadence Design Systems Inc

Co-Chair: Ji Zheng – Aurora-system

Expert: Chi-te Chen – Intel Corporation

Co-Chair: Janet O'Neil – ETS-Lindgren

Co-Chair: Zhong Chen – ETS-Lindgren

Co-Chair: Patrick DeRoy – Analog Devices Inc.

Co-Chair: Sudhama Shastri – Nexperia

Chair: Jack McFadden – ETS-Lindgren

Co-Chair: Bob Mitchell – TÜV Rheinland N.A.

Presenting Author: Walker Turner – Nvidia Corporation

Presenting Author: Chuck Bunting – Oklahoma State University

Presenting Author: Kinger Cai – Intel Corporation

Presenting Author: Zhong Chen – ETS-Lindgren

Presenting Author: Ajeya Gupta – Ford Motor Corporation

Presenting Author: Alistair Duffy – De Montfort University

Presenting Author: Lijun Jiang – Missouri University of Science and Technology

Presenting Author: Kinger Cai – Intel Corporation

Presenting Author: Doug Cochran – Arizona State University

Presenting Author: Patrick DeRoy – Analog Devices Inc.

Presenting Author: Ross Carlton – Gibbs & Cox

Presenting Author: Wendel Williamson – Raytheon Technologies

Presenting Author: Bruce Archambeault – Missouri University of Science and Technology

Presenting Author: Kinger Cai – Intel Corporation

Presenting Author: Chulsoon Hwang – Missouri University of Science & Technology

Presenting Author: Sudhama Shastri – Nexperia

Presenting Author: Jack McFadden – ETS-Lindgren

Presenting Author: Thanh Tran – Rice University

Presenting Author: Daniele Romano – Universita_degli Studi dell'Aquila

Presenting Author: Kinger Cai – Intel Corporation

Presenting Author: Dennis Lewis – The Boeing Company

Presenting Author: Sudhama Shastri – Nexperia

Presenting Author: Todd Hubing – LearnEMC

Presenting Author: Qiang Li – Virginia Polytechnic Institute and State University

Presenting Author: A. Mori – IDS

Presenting Author: Gautam Dasarathy – Arizona State University

Presenting Author: Bob Mitchell – TÜV Rheinland N.A.

Chair: Lijun Jiang – Missouri University of Science and Technology

Chair: Lijun Jiang – Missouri University of Science and Technology

Co-Chair: Alistair Duffy – De Montfort University

Presenting Author: Alistair Duffy – De Montfort University

Presenting Author: Joungho Kim – Korea Advanced Institute of Science and Technology (KAIST)

Presenting Author: Christian Schuster – Hamburg University of Technology (TUHH)

Presenting Author: ErPing Li – Zhejiang University

Presenting Author: Matteo Cocchini – IBM

Presenting Author: Jose Schutt-Aine – University of Illinois at Urbana-Champaign

Presenting Author: Samuel Connor – IBM Corp.

Presenting Author: Sebastian Salas Laurens – Eindhoven University of Technology

Presenting Author: Lijun Jiang – Missouri University of Science and Technology

Presenting Author: Philipp Boettcher – The Boeing Company

Chair: Grant Schmidbauer – Nemko North America, Inc.

Co-Chair: John Allen – IEEE Product Safety Engineering Society

Co-Chair: Kevin Hight – Thermo Fisher Scientific

Chair: Vignesh Rajamani – Exponent Inc.

Chair: Patrick DeRoy – Analog Devices Inc.

Co-Chair: Davy Pissoort – Katholieke Universiteit Leuven

Co-Chair: Bruce Archambeault – Missouri University of Science and Technology

Co-Chair: Sebastian Koj – Jade Hochschule

Co-Chair: Niek Moonen – Universiteit Twente

Chair: Zhen Zhou – Intel Corporation

Presenting Author: Niek Moonen – Universiteit Twente

Presenting Author: Sebastian Koj – Jade Hochschule

Presenting Author: Flavia Grassi – Politecnico di Milano

Presenting Author: Michelle Liu – Tesla Inc.

Presenting Author: Cong Li – GE Global Research

Presenting Author: Kevin Hight – Thermo Fisher Scientific

Presenting Author: John Allen – IEEE Product Safety Engineering Society

Presenting Author: Grant Schmidbauer – Nemko North America, Inc.

Presenting Author: Grant Schmidbauer – Nemko North America, Inc.

Presenting Author: Vignesh Rajamani – Exponent Inc.

Presenting Author: Chuck Bunting – Oklahoma State University

Presenting Author: Carl E. Hager, IV – University of Maryland

Presenting Author: Garth D'Abreu – ETS-Lindgren

Presenting Author: Frank Leferink – Thales and University of Twente

Presenting Author: John Ladbury – National Institute of Standards and Technology

Presenting Author: Bruce Archambeault – Missouri University of Science and Technology

Presenting Author: Scott Piper – General Motors Company

Presenting Author: Colin E. Brench – IEEE

Presenting Author: Eric Bogatin – ECEE

Presenting Author: Davy Pissoort – Katholieke Universiteit Leuven

Presenting Author: Lesley Polka – Intel Corporation

Presenting Author: Di Hu – General Motors Company

Chair: Yansheng Wang – Rivos Inc.

Co-Chair: Giorgi Maghlakelidze – Cisco Systems Inc

Presenting Author: Giorgi Maghlakelidze – Cisco Systems Inc

Presenting Author: Eric Bogatin – ECEE

Presenting Author: Ling Zhang – Zhejiang University

Presenting Author: Se-Jung Moon – Amazon Inc.

Presenting Author: Yansheng Wang – Rivos Inc.

Presenting Author: Vidya A. Chhabria – Arizona State University

Presenting Author: David Banas – Keysight Technologies, Inc.

Presenting Author: Yansheng Wang – Rivos Inc.

Expert: Richard Hoad – QinetiQ Group Plc

Expert: Sergio Longoria – ETS-Lindgren

Expert: William Radasky – Metatech Corporation

Expert: Edl Schamiloglu – University of New Mexico

Chair: Marina Koledintseva – Boeing Defense Space and Security

Co-Chair: Daryl Beetner – Missouri University of Science and Technology

Co-Chair: Dennis Lewis – The Boeing Company

Co-Chair: Janet O'Neil – ETS-Lindgren

Chair: Kimball Williams – IEEE

Presenting Author: Karol Niewiadomski – University of Twente

Presenting Author: John Ladbury – National Institute of Standards and Technology

Presenting Author: Zhong Chen – ETS-Lindgren

Presenting Author: Dennis Lewis – The Boeing Company

Presenting Author: Sven Fisahn – Bundeswehr Research Institute for Protective Technologies and NBC Protection

Presenting Author: Nicholas Abbondante – Intertek

Presenting Author: Edl Schamiloglu – University of New Mexico

Presenting Author: William Radasky – Metatech Corporation

Presenting Author: Sergio Longoria – ETS-Lindgren

Presenting Author: William Radasky – Metatech Corporation

Presenting Author: Richard Hoad – QinetiQ Group Plc

Presenting Author: Fabrizio Marra – Sapienza University of Rome

Presenting Author: Victor Khilkevich – Missouri University of Science and Technology

Presenting Author: Julia Sunderland – The Dow Chemical Company

Presenting Author: Marina Koledintseva – Boeing Defense Space and Security

Presenting Author: Md Zahidul Islam – University of Houston

Presenting Author: Seyed Mostafa Mousavi – Missouri University of Science and Technology

Presenting Author: Kimball Williams – IEEE

Presenting Author: Gary Bishop – NQ0V

Presenting Author: Chuck Bunting – Oklahoma State University

Presenting Author: Connie Kelly – IEEE